Luvn Vape
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PCB Assembly
Component Sourcing
PCB Fabrication
Box Build Assembly
Rapid Prototyping
Design Services
| General Specifications | |||
|---|---|---|---|
| PCB layer | 1-32 layers | ||
| PCB material | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards | ||
| Board type | Rigid FR-4, Rigid-Flex boards | ||
| Board thickness | 0.2mm-7.0mm | ||
| PCB dimension width | 40-500mm | ||
| Copper thickness | Min:0.5oz; Max: 4.0oz | ||
| Chip accuracy | laser recognition ±0.05mm; image recognition ±0.03mm | ||
| Component size | 0.6*0.3mm-33.5*33.5mm | ||
| BGA spherical distance | ≥0.25mm | ||
| BGA Globe distance | ≥0.25mm | ||
| BGA ball diameter | ≥0.1mm | ||
| Capability | Standard | Advanced | Premium |
|---|---|---|---|
| Maximum Layers | 6 layers | 16 layers | 24+ layers |
| Board Thickness | 0.4mm - 2.4mm | 0.3mm - 4.0mm | 0.2mm - 7.0mm |
| Copper Weight (outer) | 0.5oz - 2oz | 0.5oz - 4oz | 0.5oz - 6oz |
| Copper Weight (inner) | 0.5oz - 3oz | 0.5oz - 5oz | 0.5oz - 12oz |
| Minimum Trace/Space | 4/4 mil | 3/3 mil | 2.5/2.5 mil |
| Minimum Hole Size | 0.20mm | 0.15mm | 0.10mm (laser) |
| Impedance Control | ±10% | ±7% | ±5% |
| HDI Capability | 1+N+1 | 2+N+2 | Any layer |
| Surface Finishes | HASL, OSP, ENIG | Immersion Silver, Tin | ENEPIG, Hard Gold |
| Material Types | FR-4 Standard | FR-4 High Tg, Halogen-free | Rogers, Polyimide, Aluminum |
From Design to Final Assembly
We provide a true one-stop manufacturing solution: Design, Component sourcing, prototype, PCB fabrication, and full assembly...
Don’t want to coordinate multiple vendors? Save time, reduce effort, and boost efficiency! Start your seamless, intelligent manufacturing journey with us from now!
1. Customer satisfaction rate higher than 98.8%
2. Production passing rate higher than 99%
3. On-time delivery rate is higher than 98%
